Imprint apparatus and article manufacturing method

ABSTRACT

An imprint apparatus forms a pattern on a substrate by bringing a pattern region of a mold into contact with imprint material on the substrate and curing the imprint material. The mold has first and second surfaces. The first surface includes the pattern region and a peripheral region surrounding the pattern region. The second surface includes a held region. The imprint apparatus includes a mold driving mechanism to hold the held region of the mold and drive the mold, a mold conveyance mechanism to hold the peripheral region of the mold and convey the mold, and a controller to control the mold conveyance mechanism based on thickness between the peripheral region and the held region.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an imprint apparatus and an articlemanufacturing method.

Description of the Related Art

In an imprint apparatus, a pattern is formed on a substrate by bringinga pattern region of a mold into contact with an imprint material on thesubstrate and curing the imprint material. The mold can be also referredto as a template or an original. The mold is held and driven by a molddriving mechanism. The mold driving mechanism can drive the mold so asto bring a pattern surface of the mold into contact with the imprintmaterial on the substrate and separate the mold from the cured imprintmaterial. Alternatively, the mold driving mechanism can drive the moldso as to align a shot region of the substrate and the pattern region ofthe mold. Since driving of the mold by the mold driving mechanismrequires very high accuracy, it is difficult to increase the drivingrange of the mold driving mechanism. Hence, the mold is handed over froma mold conveyance mechanism to the mold driving mechanism after it ispositioned with high accuracy.

However, as imprint techniques become more widespread, molds that havevarious thicknesses can appear. For example, other than a mold which ismanufactured by processing a single quartz member, there is a mold whichis manufactured by joining a first plate member and a second platemember. The latter mold has been disclosed in Japanese Patent Laid-OpenNo. 2016-72403. Also, even molds that are manufactured by the same typeof manufacturing method may have various thicknesses due to, forexample, a generational change.

For example, in a case in which the mold driving mechanism is to holdthe upper surface of the mold, the mold conveyance mechanism can have anarrangement in which the mold is handed over to the mold drivingmechanism in a state where the lower surface of the mold is held by themold conveyance mechanism. In this case, if a method of positioning theheight of the lower surface of the mold at a predetermined height isadopted when the mold conveyance mechanism is to hand over the mold tothe mold driving mechanism, the position of the upper surface of themold can change depending on the type of the mold. This requires themold driving mechanism to have a stroke that can cope with such change.Alternatively, even in a case in which the mold conveyance mechanismholds the mold by chucking a side surface or the like of the mold, asimilar problem can occur if the method of positioning the height of thelower surface of the mold at a predetermined height is adopted.

SUMMARY OF THE INVENTION

The present invention provides a technique advantageous in performing ahandover of a mold between a mold driving mechanism and a moldconveyance mechanism regardless of the thickness of the mold.

One of aspects of the present invention provides an imprint apparatusthat forms a pattern on a substrate by bringing a pattern region of amold into contact with an imprint material on the substrate and curingthe imprint material, wherein the mold has a first surface and a secondsurface on sides opposite to each other, the first surface including thepattern region and a peripheral region which surrounds the patternregion, the second surface including a held region, and the imprintapparatus comprises a mold driving mechanism configured to hold the heldregion of the mold and drive the mold, a mold conveyance mechanismconfigured to hold the peripheral region of the mold and convey themold, and a controller configured to control, when handover of the moldis to be performed between the mold driving mechanism and the moldconveyance mechanism, the mold conveyance mechanism based on thicknessinformation which indicates a distance between the peripheral region andthe held region.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing the arrangement of an imprintapparatus according to an embodiment of the present invention;

FIGS. 2A to 2D are schematic views showing a state in which a mold,which has been positioned by a mold positioning mechanism, is conveyedby a mold conveyance mechanism to a mold chuck of a mold drivingmechanism;

FIG. 3A is a schematic view showing a state in which a peripheral regionof a mold of a first type is held by a mold conveyance chuck;

FIG. 3B is a schematic view showing a state in which a peripheral regionof a mold of a second type is held by the mold conveyance chuck;

FIGS. 4A to 4F are views for explaining a driving correction amount inthe handover of the mold of the first type and that in the handover ofthe mold of the second type;

FIGS. 5A to 5C are schematic views showing a state in which thethickness of the mold is measured;

FIG. 6 is a schematic view showing light which is detected by ameasurement device by the method exemplified in FIGS. 5A to 5C;

FIG. 7 is a flowchart showing an operation of an imprint apparatusaccording to the first embodiment;

FIG. 8 is a flowchart showing an operation of an imprint apparatusaccording to the second embodiment; and

FIGS. 9A to 9F are views exemplifying an article manufacturing method.

DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present invention will be describedhereinafter with reference to the accompanying drawings.

FIG. 1 schematically shows the arrangement of an imprint apparatus 1according to an embodiment of the present invention. The imprintapparatus 1 forms a pattern made of a cured product of an imprintmaterial 15 on a substrate 18 by bringing the imprint material 15 on thesubstrate 18 into contact with a pattern region of a mold 17 and curingthe imprint material 15.

A curable composition (to be also referred to as an uncured resin) thatis cured by application of a curing energy 3 is used as the imprintmaterial. An electromagnetic wave, heat, or the like is used as thecuring energy. As the electromagnetic wave, for example, light such asinfrared light, visible rays, ultraviolet light, or the like whosewavelength is selected from a range of 10 nm (inclusive) to 1 mm(inclusive) is used. The curable composition can be a composition thatis cured by light irradiation or application of heat. Of thesecompositions, a photo-curable composition that is cured by lightcontains at least a polymerizable compound and a photopolymerizationinitiator, and may contain a non-polymerizable compound or solvent asneeded. The non-polymerizable compound is at least a material selectedfrom a group consisting of a sensitizer, a hydrogen donor, an internalmold release agent, a surfactant, an antioxidant, a polymer component,and the like. An imprint material may be supplied in a droplet form, anisland form with droplets being chained together, or a film form onto asubstrate. The viscosity (at 25° C.) of the imprint material is 1 mPa·s(inclusive) to 100 mPa·s (inclusive). Glass, a ceramic, a metal, asemiconductor, or a resin can be used as the material of a substrate. Amember formed from a material different from the substrate may be formedon its surface, as needed. The substrate is, for example, a siliconwafer, a compound semiconductor wafer, or a silica glass wafer.

In this specification and the accompanying drawings, directions areshown in an X-Y-Z coordinate system in which a direction parallel to thesurface of the substrate 18 forms an X-Y plane. Let an X direction, a Ydirection, and a Z direction be the directions parallel to an X-axis, aY-axis, and a Z-axis, respectively, in the X-Y-Z coordinate system. LetθX, θY, and θZ be rotation about the X-axis, rotation about the Y-axis,and rotation about the Z-axis, respectively. Control or driving withregard to the X-axis, the Y-axis, and the Z-axis means control ordriving with regard to the direction parallel to the X-axis, thedirection parallel to the Y-axis, and the direction parallel to theZ-axis, respectively. Further, control or driving with regard to aθX-axis, a θY-axis, and a θZ-axis means control or driving with regardto rotation about an axis parallel to the X-axis, rotation about an axisparallel to the Y-axis, and rotation about an axis parallel to theZ-axis, respectively. A position is information that can be specifiedbased on X-axis, Y-axis, and Z-axis coordinates. An attitude isinformation that can be specified by values on the θX-axis, the θY-axis,and the θZ-axis. Positioning means controlling the position and/orattitude. Alignment can include the control of the position and/orattitude of at least one of the substrate and the mold.

The imprint apparatus 1 can include a curing unit 2, a mold positioningmechanism 24, a substrate driving mechanism 11, a mold driving mechanism6, a mold conveyance mechanism 29, a dispenser 14, an alignmentmeasurement device 16, a controller 19, and a memory 30. An externalapparatus 100 can be arranged outside the imprint apparatus 1.

In FIG. 1, the mold 17 which is arranged in the mold positioningmechanism 24 is indicated by a dotted line and the mold 17 which is heldby the mold driving mechanism 6 is indicated by a solid line. Asexemplified in FIGS. 3A and 3B, the mold 17 has a first surface S1 and asecond surface S2 that are on sides opposite to each to other. The firstsurface S1 includes a pattern region 33 and a peripheral region 34 whichsurrounds the pattern region 33. The second surface S2 includes a heldregion 35 which is held by the mold driving mechanism 6. The mold 17 canbe formed from a material, for example, such as quartz, that cantransmit the energy 3 (for example, ultraviolet rays). In the imprintapparatus 1, the mold 17 can be handled in an attitude in which thefirst surface S1 (pattern region 33) faces downward. The curing unit 2can be formed, in one example, so as to irradiate the imprint material15 with ultraviolet rays serving as the energy 3, and can include, forexample, a light source 4 and an optical element 5 (for example, a lens,a mirror, a filter, or the like) that adjusts the ultraviolet rays fromthe light source 4.

The mold positioning mechanism 24 positions the mold 17, which isconveyed from outside of the imprint apparatus 1 by a conveyance device,so that the mold can be conveyed by the mold conveyance mechanism 29 tothe mold driving mechanism 6 and handed over to the mold drivingmechanism 6. The positioning of the mold 17 by the mold positioningmechanism 24 can be performed with respect to, for example, the X-axis,the Y-axis, and the θZ-axis. The mold positioning mechanism 24 caninclude, for example, a first measurement device 25, a mold conveyancechuck 26, a chuck holding mechanism 27, and a driving mechanism 28. Notethat the mold conveyance chuck 26 can be understood as a component ofthe mold conveyance mechanism 29.

The first measurement device 25 is a measurement device that measuresthe mold 17 as a target. The first measurement device 25 can include,for example, a displacement sensor. The mold conveyance chuck 26 chucks(holds) and releases the mold 17. The chuck holding mechanism 27 chucks(holds) and releases the mold conveyance chuck 26. The chuck holdingmechanism 27 is supported by a driving mechanism 28. The drivingmechanism 28 can drive the chuck holding mechanism 27 with respect tothe X-axis, the Y-axis, and the θZ-axis to position the mold 17 held viathe chuck holding mechanism 27 and the mold conveyance chuck 26. Basedon the measurement result of the first measurement device 25, the mold17 is positioned by the driving mechanism 28 driving the chuck holdingmechanism 27 relatively with respect to the mold conveyance mechanism29.

Although only one first measurement device 25 is shown in FIG. 1, it ispossible to arrange at least three first measurement devices 25. Forexample, in a case in which three first measurement devices 25 are to bearranged, two first measurement devices 25 can be arranged so as tomeasure a side surface which is almost parallel to the X-axis directionof the mold 17, and the remaining one first measurement device 25 can bearranged to measure a side surface which is almost parallel to theY-axis direction of the mold 17. As a result, positioning in the Y-axisdirection can be performed since it is possible to know the displacementamount in the Y-axis direction of the mold 17 from one of or the averagevalue of the two measurement results by the two first measurementdevices 25 capable of measuring a side surface which is almost parallelto the X-axis direction. Positioning in the X-axis direction can also beperformed since it is possible to know the displacement amount in theX-axis direction of the mold 17 from the measurement result by the onefirst measurement device capable of measuring a side surface which isalmost parallel to the Y-axis direction. Furthermore, rotation directionpositioning about the θZ-axis can be performed since it is possible toknow the rotational displacement amount with respect to the θZ-axis ofthe mold 17 from the difference information between the measurementresults of the two first measurement devices capable of measuring a sidesurface almost parallel to the X-axis direction.

The substrate driving mechanism 11 holds the substrate 18 and can beformed so as to drive the substrate 18 about a plurality of axes (forexample the three axes of the X-, Y-, and θZ-axes or preferably the sixaxes of X-, Y-, Z-, θX-, θY-, and θZ-axes). The substrate drivingmechanism 11 can include a substrate chuck 12 and a driving mechanism13. The substrate chuck 12 holds the substrate 18 by a chuck such as avacuum chuck. The driving mechanism 13 drives the substrate 18 about theplurality of axes by driving the substrate chuck 12 about the pluralityof axes.

The mold driving mechanism 6 holds the mold 17 and can be formed so asto drive the mold 17 about a plurality of axes (for example the threeaxes of the Z, θX, and θY-axes or preferably the six axes of X, Y, Z,θX, θY, and θZ-axes). The mold driving mechanism 6 can include a moldchuck 7, an actuator 8, a mold deforming mechanism 9, and a secondmeasurement device 10. The mold chuck 7 holds the mold 17 by a chucksuch as a vacuum chuck. The actuator 8 drives the mold 17 about theplurality of axes by driving the mold chuck 7 about the plurality ofaxes. The mold deforming mechanism 9 is a mechanism for correcting theshape of the mold 17, is arranged so as to surround the side surface ofthe mold 17, and corrects the shape of the mold 17 by applying a forceon the side surface of the mold 17 or displacing the side surface of themold. The second measurement device 10 is a measurement device thatmeasures the side surface of the mold 17 and can be, more particularly,a displacement sensor.

The mold conveyance mechanism 29 conveys the mold 17 from the moldpositioning mechanism 24 to the mold chuck 7 of the mold drivingmechanism 6 and hands over the mold to the mold chuck 7. The moldconveyance mechanism 29 can be formed to convey the mold 17 by conveyingthe mold conveyance chuck 26 in a state in which the mold conveyancechuck 26 is held by a chuck such as a vacuum chuck.

The dispenser 14 arranges the imprint material 15 on the substrate 18.The dispenser 14 arranges the imprint material 15 on the substrate 18 bydischarging (dropping) the imprint material 15 in a state in which thesubstrate 18 is driven by the substrate driving mechanism 11. Thealignment measurement device 16 aligns the shot region of the substrateand the pattern region of the mold 17 by using a shot region mark of thesubstrate 18 and a mark of the mold 17.

The controller 19 controls the above-described components of the imprintapparatus 1, for example, the curing unit 2, the mold positioningmechanism 24, the substrate driving mechanism 11, the mold drivingmechanism 6, the mold conveyance mechanism 29, the dispenser 14, and thealignment measurement device 16. The controller 19 can be formed from aPLD (Programmable Logic Device) such as an FPGA (Field Programmable GateArray), an ASIC (Application Specific Integrated Circuit), ageneral-purpose computer installed with a program, or a combination ofall or some of these components.

The memory 30 stores, for example, information necessary for controllingthe imprint process, conveyance of the mold 17, and the conveyance ofthe substrate 18. The imprint process can include a process of bringingthe pattern region of the mold 17 into contact with the imprint material15 on the substrate 18, forming a pattern on the substrate 18 by curingthe imprint material 15, and separating the mold 17 from the pattern.The imprint process can also include a process of arranging the imprintmaterial 15 on the substrate 18 by using the dispenser 14. The memory 30can include a non-volatile memory 40. The non-volatile memory 40 can beformed from, for example, an EEPROM or an MRAM (Magnetoresistive RandomAccess Memory). Alternatively, the non-volatile memory 40 can be formedfrom a volatile memory such as a DRAM or an SRAM which is backed up by abattery.

The imprint apparatus 1 can include a base structure 21 for holding thesubstrate driving mechanism 11, the curing unit 2, the mold drivingmechanism 6, the mold positioning mechanism 24, the dispenser 14, abridging structure 22 which supports the dispenser 14 and the moldconveyance mechanism 29, and a column 23 which supports the bridgingstructure 22. The mold conveyance mechanism 29 can be supported by thebase structure 21 instead of the bridging structure 22. The imprintapparatus 1 can include a conveyance mechanism that conveys the mold 17from outside the imprint apparatus 1 to the mold conveyance mechanism29.

FIGS. 2A to 2D schematically show the mold 17, which has been positionedby the mold positioning mechanism 24, being conveyed to the mold chuck 7of the mold driving mechanism 6 by the mold conveyance mechanism 29.First, as shown in FIG. 2A, the mold 17 is conveyed to a positionimmediately below the mold driving mechanism 6 by the mold conveyancemechanism 29. Next, as shown in FIG. 2B, the mold 17 is conveyed to ahandover position by the mold conveyance mechanism 29. In this example,the mold 17 is conveyed to the handover position by relatively raising atable 31 with respect to a support unit 32. The position of the table 31is detected by a sensor (not shown, for example, an encoder), and thetable 31 can be driven based on this detection result.

Next, as shown in FIG. 2C, the actuator 8 of the mold driving mechanism6 lowers the mold chuck 7 and brings the mold chuck 7 into contact withthe mold 17. Here, the lowering amount of the mold chuck 7 by theactuator 8 may be a preset amount or the lowering of the mold chuck 7 bythe actuator 8 may be stopped by detecting the contact of the mold chuck7 to the mold 17. Subsequently, as shown in FIG. 2D, the mold 17 is heldby the mold chuck 7 and the table 31 of the mold conveyance mechanism 29is lowered.

FIG. 3A schematically shows a state in which the peripheral region 34 ofthe mold 17 of a first type is held by the mold conveyance chuck 26. Themold 17 of the first type is manufactured by processing a single quartzmember. FIG. 3B schematically shows a state in which the peripheralregion 34 of the mold 17 of a second type is held by the mold conveyancechuck 26. The mold 17 of the second type can be manufactured by joiningtwo members. The mold 17 of the first type and the mold 17 of the secondtype each have the first surface S1 and the second surface S2 which areon sides opposite to each other. The first surface S1 includes thepattern region 33 and the peripheral region 34 which surrounds thepattern region 33. The second surface S2 includes the held region 35held by the mold driving mechanism 6. These points are characteristicsin common between the mold 17 of the first type and the mold 17 of thesecond type. However, a thickness 36 of the mold 17 can differ betweenthe mold 17 of the first type and the mold 17 of the second type. Here,the thickness 36 is the distance between the peripheral region 34 of thefirst surface S1 and the held region 35 of the second surface S2.

FIG. 4A shows the definition of the dimensions of the mold 17 of thefirst type. A maximum thickness T is defined as the distance between thepattern region 33 of the first surface S1 and the second surface S2. Athickness (protrusion amount) T1 is defined as the height differencebetween the pattern region 33 and the peripheral region 34. A thicknessT2 is the aforementioned thickness 36 and is defined as the distancebetween the peripheral region 34 of the first surface S1 and the heldregion 35 of the second surface S2. T=T1+T2. In one example, the maximumthickness T can be 6.35 mm, and the thickness Ti can be 20 μm(inclusive) to 40 μm (inclusive).

FIG. 4B shows the definition of the dimensions of the mold 17 of thesecond type. A maximum thickness T′ is defined as the distance betweenthe pattern region 33 of the first surface S1 and the second surface S2.A thickness (protrusion amount) T1′ is defined as the height differencebetween the pattern region 33 and the peripheral region 34. A thicknessT2′ is the aforementioned thickness 36 and is defined as the distancebetween the peripheral region 34 of the first surface S1 and the heldregion 35 of the second surface S2. T′=T1′+T2′. The mold 17 of thesecond type can be manufactured by joining two members, that is, a firstmember M1 that includes the pattern region 33 and a second member M2that includes the held region 35. To strengthen the first member M1, thethickness (thickness T1′) of the first member M1 can be 1 mm or more.Although it is preferable for the maximum thickness T of the mold 17 ofthe first type and the maximum thickness T′ of the mold 17 of the secondtype to be the same as each other, they may differ from each other.

FIG. 4C schematically shows the state of the handover of the mold 17 ofthe first type from (the mold conveyance chuck 26 of) the moldconveyance mechanism 29 to (the mold chuck 7) of the mold drivingmechanism 6. At this time, the mold 17 of the first type is driven bythe mold conveyance mechanism 29 so as to position the held region 35 ofthe mold 17 of the first type at a first height SP below the mold chuck7. Let ZS1 be a driving amount of the mold 17 in the Z-axis direction atthis time. The driving amount ZS1 is determined by the thickness T2 ofthe mold 17 of the first type. A distance (height difference) D betweenthe chuck surface of the mold chuck 7 and the first height SP is set tofall within a stroke (driving range) in the Z-axis direction of the molddriving mechanism 6.

FIG. 4D schematically shows the state of the handover of the mold 17 ofthe second type from (the mold conveyance chuck 26 of) the moldconveyance mechanism 29 to (the mold chuck 7) of the mold drivingmechanism 6. At this time, the mold 17 of the second type needs to bedriven by the mold conveyance mechanism 29 so as to position the heldregion 35 of the mold 17 of the second type at the first height SP. LetZS2 be a driving amount of the mold 17 of the second type in the Z-axisdirection at this time. The difference between the driving amount ZS2and the driving amount ZS1 is a driving correction amount ZSofs(=ZS2−ZS1). The driving correction amount ZSofs is the difference(T2−T2′) between the thickness T2 of the mold 17 of the first type andthe thickness T2′ of the mold 17 of the second type. Here, the referencethickness and the reference driving amount of the thickness T2 and thedriving amount ZS1, respectively, can be predetermined. Hence, thecontroller 19 can determine the driving correction amount ZSofs(=T2−T2′) by obtaining the thickness information indicating thethickness T2′ of the mold 17 of the second type or determine the drivingamount ZS2 (=ZS1+ZSofs). Alternatively, the controller 19 can determinethe driving amount ZS2 (=ZS1+T2−T2′) based on the driving amount ZS1,the thickness T2, and the thickness T2′. The controller 19 cansubsequently control the mold conveyance mechanism 29 (the conveyance ofthe mold 17 by the mold conveyance mechanism 29) based on the drivingamount ZS2. More specifically, the controller 19 can control the moldconveyance mechanism 29 (the conveyance of the mold 17 by the moldconveyance mechanism 29) based on the driving amount ZS2 so that theheld region 35 of the mold 17 will match the first height SP.

The first height SP is the height at which the held region 35 of themold 17 is to be positioned by the mold conveyance mechanism 29 when themold 17 of the first type and that of the second type each are to behanded over from (the mold conveyance chuck 26 of) the mold conveyancemechanism 29 to (the mold chuck 7 of) the mold driving mechanism 6.

FIG. 4E schematically shows the state of the handover of the mold 17 ofthe first type from (the mold chuck 7 of) the mold driving mechanism 6to (the mold conveyance chuck 26 of) the mold conveyance mechanism 29.At this time, the mold 17 is positioned by the mold driving mechanism 6so as to match the held region 35 of the mold 17 of the first type to asecond height RP. Here, the second height RP can be the same height asthe first height SP but may be a height different from the first heightSR. The second height RP is a height at which the held region 35 of themold 17 is to be positioned by the mold driving mechanism 6 when themold 17 of the first type and that of the second type each are to behanded over from (the mold chuck 7 of) the mold driving mechanism 6 to(the mold conveyance chuck 26 of) the mold conveyance mechanism 29.

To receive the mold 17 of the first type which has been positioned bythe mold driving mechanism 6 so that the held region 35 will match thesecond height RP, the mold conveyance mechanism 29 drives the table 31(mold conveyance chuck 26) so as to bring the mold conveyance chuck 26into contact with the peripheral region 34 of the mold 17. At this time,let ZR1 be a driving amount of the table 31 (mold conveyance chuck 26)in the Z-axis direction. The driving amount ZR1 is determined by thethickness T2 of the mold 17 of the first type.

FIG. 4F schematically shows the state of the handover of the mold 17 ofthe second type from (the mold chuck 7 of) the mold driving mechanism 6to (the mold conveyance chuck 26 of) the mold conveyance mechanism 29.At this time, the mold 17 is positioned by the mold driving mechanism 6so that the held region 35 of the mold 17 of the second type will matchthe second height RP. To receive the mold 17 of the second type whichhas been positioned by the mold driving mechanism 6 so that the heldregion 35 will match the second height RP, the mold conveyance mechanism29 drives the table 31 (mold conveyance chuck 26) so as to bring themold conveyance chuck 26 into contact with the peripheral region 34 ofthe mold 17 of the second type. At this time, let ZR2 be a drivingamount of the table 31 (mold conveyance chuck 26) in the Z-axisdirection. The driving amount ZR2 is determined by the thickness T2′ ofthe mold 17 of the second type.

The difference between the driving amount ZR2 and the driving amount ZR1is a driving correction amount ZRofs (=ZR2−ZR1). The driving correctionamount ZRofs is the difference (T2−T2′) between the thickness T2 of themold 17 of the first type and the thickness T2′ of the mold 17 of thesecond type. Here, the thickness T2 and the driving amount ZR1 can bepredetermined as the reference thickness and the reference drivingamount, respectively. Hence, the controller 19 can determine the drivingcorrection amount ZRofs (=T2−T2′) by obtaining the thickness informationindicating the thickness T2′ of the mold 17 of the second type ordetermine the driving amount ZR2 (=ZR1+ZRofs). Alternatively, thecontroller 19 can determine the driving amount ZR2 (=ZR1+T2−T2′) basedon the driving amount ZR1, the thickness T2, and the thickness T2′. Thecontroller 19 can subsequently control the mold conveyance mechanism 29based on the driving amount ZR2. More specifically, the controller 19can control the mold conveyance mechanism 29 based on the driving amountZR2 so as to bring the mold conveyance chuck 26 into contact with theperipheral region 34 of the mold 17 whose held region 35 has beenpositioned by the mold driving mechanism 6 so as to match the secondheight RP.

FIGS. 5A to 5C exemplify a state in which the thickness T2 or T2′ of themold 17 is measured. The imprint apparatus 1 can include a measurementdevice 37 that measures the thickness T2 or T2′ of the mold 17. Themeasurement device 37 may be the first measurement device 25. In thiscase, other than obtaining the thickness information indicating thethickness T2, the first measurement device 25 is used to measure atleast one of a position and an attitude of the mold 17.

In this example, the measurement device 37 emits measurement light 38and detects the reflected light that is reflected and returned from themold 17 which is the measurement target object. A state in which thereflected light returns to the measurement device 37 is the “lightreception=ON” state, and a state in which the reflected light is notreturned is the “light reception=OFF” state. As exemplified in FIGS. 5Ato 5C, the mold 17 is driven by the mold conveyance mechanism 29 so thatthe side surface of the mold 17 held by the mold conveyance chuck 26cuts across the measurement light 38 of the measurement device 37. Thedriving range of the mold 17 by the mold conveyance mechanism 29 may bepreset in accordance with the range of the expected thickness of themold 17 or the driving of the mold 17 by the mold conveyance mechanism29 may be stopped in accordance with the state changing from the lightreception=ON state to the light reception=OFF state. In this case, themeasurement of the thickness T2 or T2′ of the mold 17 can be completedin a shorter time. Note that the measurement method of the thickness T2or T2′ of the mold 17 is not limited to the above-described example, andvarious kinds of measurement methods can be adopted.

FIG. 6 exemplifies a light reception result of the reflected light fromthe side surface of the mold 17 obtained when the measurement device 37measures the thickness T2 or T2′ of the mold 17. A section A correspondsto the state shown in FIG. 5A, a section B corresponds to the stateshown in FIG. 5B, and a section C corresponds to the state shown in FIG.5C. At the measurement of the thickness T2 of the mold 17 of the firsttype, the light reception=ON period can be a width t2 corresponding tothe thickness T2, and at the measurement of the thickness T2° of themold 17 of the second type, the light reception=ON period can be a widtht2′ corresponding to the thickness T2′.

FIG. 7 shows an operation of an imprint apparatus 1 according to thefirst embodiment. The operation shown in FIG. 7 is controlled by acontroller 19. In step S701, for example, a mold 17 is conveyed by aconveying mechanism (not shown) from a carrier arranged in a load portto a mold conveyance chuck 26 of the mold conveyance mechanism 29, andthe mold 17 is subsequently conveyed by the mold conveyance mechanism 29to a measurement region of a measurement device 37. In step S702, athickness T2 or T2′ of the mold 17 is measured by the measurement device37, and the thickness information of the thickness T2 or T2′ isgenerated. The thickness information is stored in a memory 30 (forexample, a non-volatile memory 40) and is referred to in step S704.

The following steps S703 and S704 may be executed in parallel or one ofthe steps may be executed ahead. In step S703, the mold 17 is positionedby a mold positioning mechanism 24. In step S704, the controller 19determines driving amounts ZS2 and ZR2 based on the thicknessinformation generated and stored in the memory 30 in step S702. Here,although the driving amounts to be used are driving amounts ZS1 and ZR1in a case in which the mold 17 of a first type is to be used, theprocess may be executed by assuming that each mold is the mold 17 of thesecond type without discriminating between the first type and the secondtype. In this case, when the mold 17 of the first type is to be used, ameasurement value represented as T2′=T2 is obtained from the measurementby the measurement device 37, ZSofs=0 and ZRofs=0, and thus the drivingamounts ZS2=ZS1 and ZR2=ZR1. The driving amounts ZS2 and ZR2 will beused hereinafter, without discrimination between the first type and thesecond type, even when the mold 17 of the first type is used. Thedriving amounts ZS2 and ZR2 are stored in the memory 30 (for example,the non-volatile memory 40) and referred to in steps S705 and S709.

Here, the controller 19 can store, each time the thickness informationis determined in step S702 by measuring the thickness T2′ of the mold17, the thickness information as the latest thickness information in thenon-volatile memory 40. In this case, the driving amounts ZS2 and ZR2are preferably determined in steps S705 and S709, respectively, based onthe thickness information. As a result, even after the imprint apparatus1 is temporarily stopped due to a power failure or the like, if thethickness information indicating the thickness T2′ of the mold 17 hasbeen stored in the non-volatile memory 40, the process can be restartedbased on the stored thickness information. For example, in a case inwhich the imprint apparatus 1 is temporarily stopped before the mold 17is handed over from the mold conveyance mechanism 29 to a mold drivingmechanism 6 and the operation is subsequently restarted, the thicknessT2′ of the mold 17 need not be measured again by the measurement device37. Also, even in a case in which the imprint apparatus 1 has beentemporarily stopped, before step S709, after the thickness informationhas been stored in the non-volatile memory 40, the controller 19 cancorrectly recognize the thickness information of the mold 17 held by amold chuck 7. Hence, when the mold 17 which is held by the mold chuck 7is to be handed over to the mold conveyance mechanism 29, the moldconveyance chuck 26 of the mold conveyance mechanism 29 can be driven tothe correct position to receive the mold 17.

Alternatively, each time the driving amounts ZS2 and ZR2 (controlinformation for controlling the mold conveyance mechanism 29) aredetermined, the controller 19 can store these driving amounts ZS2 andZR2 as the latest driving amounts ZS2 and ZR2 in the non-volatile memory40. For example, in a case in which the imprint apparatus 1 istemporarily stopped before the mold 17 is handed over from the moldconveyance mechanism 29 to the mold driving mechanism 6 and theoperation is subsequently restarted, the driving amounts ZS2 and ZR2need not be determined again by re-measuring the thickness T2′ of themold 17 by the measurement device 37. Also, even if the imprintapparatus 1 has temporarily stopped due to a power failure or the like,the process can be restarted based on the latest driving amounts ZS2 andZR2. Furthermore, even in a case in which the imprint apparatus 1 hasbeen temporarily stopped, before step S709, after the driving amountsZS2 and ZR2 have been stored in the non-volatile memory 40, thecontroller 19 can obtain the correct driving amount ZR2 corresponding tothe thickness information of the mold 17 which is held by the mold chuck7. Hence, when the mold 17 held by the mold chuck 7 is to be handed overto the mold conveyance mechanism 29, the mold conveyance chuck 26 of themold conveyance mechanism 29 can be driven to the correct position toreceive the mold 17.

In step S705, the controller 19 controls, based on the driving amountZS2 determined in step S704, the driving of the mold 17 by the moldconveyance mechanism 29 so that a held region 35 of the mold 17 ispositioned at a first height SP below the mold chuck 7. In step S707,the controller 19 controls the mold driving mechanism 6 so that the moldchuck 7 of the mold driving mechanism 6 will receive the mold 17 whoseheld region 35 has been positioned at the first height SP below the moldchuck 7.

In step S707, an imprint process on the shot region of a substrate 18 isexecuted by using the mold 17. The imprint process is performed, forexample, on one or a plurality of substrates 18.

In step S708, the controller 19 controls the driving of the mold 17 bythe mold driving mechanism 6 so that the held region 35 of the mold 17will match a second height RP. In step S709, based on the driving amountZR2 determined in step S704, the controller 19 raises a table 31 (moldconveyance chuck 26) by controlling the mold conveyance mechanism 29 soas to bring the mold conveyance chuck 26 into contact with a peripheralregion 34 of the mold 17. In step S710, the controller 19 controls themold driving mechanism 6 and the mold conveyance mechanism 29 so thatthe mold conveyance chuck 26 of the mold conveyance mechanism 29 willreceive the mold 17 from the mold driving mechanism 6 and hold the mold.In step S711, the controller controls the mold conveyance mechanism 29so as to convey the mold 17 to a predetermined position. Subsequently,the mold 17 can be conveyed by a conveyance mechanism (not shown) to,for example, a carrier arranged in a load port.

As described above, according to the first embodiment, regardless of thethickness T2 of the mold 17, the mold 17 can be handed over from themold conveyance mechanism 29 to the mold driving mechanism 6 and themold 17 can be handed over from the mold driving mechanism 6 to the moldconveyance mechanism 29.

FIG. 8 shows an operation of an imprint apparatus 1 according to thesecond embodiment. The operation shown in FIG. 8 is controlled by acontroller 19. The second embodiment shown in FIG. 8 differs from thefirst embodiment in that step S702′, in which the imprint apparatus 1obtains the thickness information indicating a thickness T2′ of a mold17 based on information provided from an external apparatus 100, hasbeen included in place of step S702 in the first embodiment.

Here, the information provided from the external apparatus 100 caninclude a plurality of pieces of thickness information (for example, athickness T2 of the mold 17 of a first type and the thickness T2′ of themold 17 of a second type) associated with the respective plurality oftypes of the mold 17. In step S702′, in the imprint apparatus 1, adiscriminator can be used to discriminate the type of the mold 17, andthickness information corresponding to the type of the mold 17 can beobtained from the plurality of pieces of thickness information. Forexample, a measurement device 37 can be used as the discriminator. Inthis case, the measurement device 37 suffices to have a measurementaccuracy that allows discrimination of the type of the mold 17.

The measurement device 37 which serves as the discriminator can employ,for example, a sensor that determines whether the height of a heldregion 35 of the mold 17 which is held by a mold conveyance chuck 26falls within a predetermined range. The sensor can be arranged so thatit can determine whether the height of the held region 35 falls withinthe predetermined range by irradiating the held region 35 with obliqueincident light and determining whether reflected light from the heldregion 35 can be detected.

Such a discriminator can be used to determine whether the mold 17 of awrong type has been provided to the imprint apparatus 1.

A pattern of a cured product formed by using an imprint apparatus isused permanently for at least some of various articles or usedtemporarily when the various articles are manufactured. The articleincludes an electric circuit element, an optical element, a MEMS, arecording element, a sensor, a mold, or the like. The electric circuitelement includes, for example, a volatile or nonvolatile semiconductormemory such as a DRAM, an SRAM, a flash memory, or an MRAM or asemiconductor element such as an LSI, a CCD, an image sensor, or anFPGA. The mold includes an imprint mold or the like.

The pattern of the cured product is used without a change as aconstituent member of at least a part of the above-described article orused temporarily as a resist mask. The resist mask is removed afteretching, ion implantation, or the like is performed in a processing stepof the substrate.

An article manufacturing method of forming a pattern on a substrate byan imprint apparatus, processing the substrate on which the pattern hasbeen formed, and manufacturing an article from the substrate on whichthe process has been performed will be described next. As shown in FIG.9A, a substrate 1z such as a silicon wafer having a processing targetmaterial 2z such as an insulator formed on its surface is prepared, andthen an imprint material 3z is applied on the surface of the processingtarget material 2z by an inkjet method or the like. A state is shownhere in which the imprint material 3z formed into a plurality ofdroplets is applied on the substrate.

As shown in FIG. 9B, a side of an imprinting mold 4z on which itsthree-dimensional pattern is formed faces the imprint material 3z on thesubstrate. As shown in FIG. 9C, a mold 4z and the substrate 1z to whichthe imprint material 3z is applied are brought into contact with eachother, and a pressure is applied. The imprint material 3z fills the gapbetween the mold 4z and the processing target material 2z. The imprintmaterial 3z is cured by irradiating it with light as curing energythrough the mold 4z in this state.

As shown in of FIG. 9D, the pattern of the cured product of the imprintmaterial 3z is formed on the substrate 1z by releasing the mold 4z andthe substrate 1z from each other after curing the imprint material 3z.The pattern of this cured product has a shape such that the concaveportion of the mold corresponds to the convex portion of the curedproduct, and the convex portion of the mold corresponds to the concaveportion of the cured product. That is, the three-dimensional pattern ofthe mold 4z is transferred to the imprint material 3z.

As shown in of FIG. 9E, out of the surface of the processing targetmaterial 2z, portions without any cured product or portions where thecured products remain thin are removed and become trenches 5z byperforming etching using the pattern of the cured product as an etchingresistant mask. As shown in FIG. 9F, an article having the trenches 5zformed in the surface of the processing target material 2z can beobtained by removing the pattern of the cured product. The pattern ofthe cured product is removed here. However, the pattern of the curedproduct may be used as, for example, an interlayer dielectric filmincluded in the semiconductor element or the like, that is, theconstituent member of the article without removing it after processing.

Although the above description is related to an imprint apparatus, themold may be read instead as an original and the imprint apparatus may beread instead as a pattern forming apparatus. The pattern formingapparatus can include, other than the imprint apparatus, an exposureapparatus such as an EUV exposure apparatus or the like. In the exposureapparatus such as an EUV exposure apparatus, a reticle is used as theoriginal. The original that is used in the exposure apparatus such as anEUV exposure apparatus can be manufactured by processing low thermalexpansion glass. Such an original can be manufactured by joining a basemember and a member with a pattern and can have a plurality of types ofthicknesses.

Such a pattern forming apparatus 1 is formed as an apparatus that formsa pattern on a substrate 18 by using an original 17. The original 17 canhave a first surface S1 and a second surface S2 that are on sidesopposite to each other. The first surface S1 can include a patternregion 33 which has a pattern to be transferred to the substrate 18 anda peripheral region 34 which surrounds the pattern region 33, and thesecond surface S2 can include a held region 35. The pattern formingapparatus 1 can include an original driving mechanism 6 which drives theoriginal 17 by holding the held region 35 of the original 17 and anoriginal conveyance mechanism 29 which conveys the original 17 byholding the peripheral region 34 of the original 17. The pattern formingapparatus 1 can include a controller 19 that controls the position ofthe original conveyance mechanism 29 based on thickness informationindicating a distance (a thickness T2 or T2′) between the peripheralregion 34 and the held region 35 when the handover of the original 17between the original driving mechanism 6 and the original conveyancemechanism 29 is to be executed.

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2017-136438, filed Jul. 12, 2017, which is hereby incorporated byreference herein in its entirety.

What is claimed is:
 1. An imprint apparatus that forms a pattern on asubstrate by bringing a pattern region of a mold into contact with animprint material on the substrate and curing the imprint material,wherein the mold has a first surface and a second surface on sidesopposite to each other, the first surface including the pattern regionand a peripheral region which surrounds the pattern region, the secondsurface including a held region, and the imprint apparatus comprises amold driving mechanism configured to hold the held region of the moldand drive the mold, a mold conveyance mechanism configured to hold theperipheral region of the mold and convey the mold, and a controllerconfigured to control, when handover of the mold is to be performedbetween the mold driving mechanism and the mold conveyance mechanism,the mold conveyance mechanism based on thickness information whichindicates a distance between the peripheral region and the held region.2. The apparatus according to claim 1, wherein the mold conveyancemechanism holds the peripheral region in a state in which the firstsurface faces downward, and the mold driving mechanism holds the heldregion in a state in which the first surface faces downward.
 3. Theapparatus according to claim 1, wherein the controller controls, whenthe mold conveyance mechanism is to hand over the mold to the molddriving mechanism, the mold conveyance mechanism based on the thicknessinformation so as to position the held region at a first height.
 4. Theapparatus according to claim 1, wherein the controller controls, whenthe mold conveyance mechanism is to receive the mold from the molddriving mechanism, the mold driving mechanism so as to position the heldregion at a second height and controls the mold conveyance mechanism soas to receive the mold from the mold driving mechanism.
 5. The apparatusaccording to claim 1, further comprising: a mold positioning mechanismconfigured to position the mold with respect to the mold conveyancemechanism.
 6. The apparatus according to claim 5, wherein the moldpositioning mechanism comprises a mold conveyance chuck configured tohold the peripheral region of the mold and position the mold withrespect to the mold conveyance mechanism in a state in which theperipheral region is held by the mold conveyance chuck, and the moldconveyance mechanism conveys the mold by conveying the mold conveyancechuck.
 7. The apparatus according to claim 5, further comprising: ameasurement device configured to obtain the thickness information bymeasuring the mold.
 8. The apparatus according to claim 7, wherein themeasurement device is arranged in the mold positioning mechanism.
 9. Theapparatus according to claim 8, wherein the measurement device is used,other than obtaining the thickness information, for measuring at leastone of a position and an attitude of the mold.
 10. The apparatusaccording to claim 1, further comprising: a measurement deviceconfigured to obtain the thickness information by measuring the mold.11. The apparatus according to claim 7, wherein the measurement deviceobtains the thickness information by measuring the mold which is held bythe mold conveyance mechanism.
 12. The apparatus according to claim 1,wherein the controller obtains the thickness information based oninformation provided from an external apparatus.
 13. The apparatusaccording to claim 12, further comprising: a discriminator configured todiscriminate a type of the mold, wherein the information includes aplurality of pieces of thickness information associated with a pluralityof types of molds, respectively, and the controller obtains, from theplurality of pieces of thickness information, the thickness informationcorresponding to the type of the mold in accordance with the typediscriminated by the discriminator.
 14. The apparatus according to claim1, wherein the controller stores, each time the thickness information ofthe mold is determined, the thickness information as the latestthickness information in a non-volatile memory.
 15. The apparatusaccording to claim 1, wherein the controller determines controlinformation for controlling the mold conveyance mechanism based on thethickness information of the mold and stores the control information ina non-volatile memory
 16. The apparatus according to claim 1, whereinthe controller stores, each time the thickness information of the moldis determined, the thickness information as the latest thicknessinformation in a non-volatile memory, and controls the mold conveyancemechanism based on the latest thickness information stored in thenon-volatile memory when the mold is to be handed over from the molddriving mechanism to the mold conveyance mechanism.
 17. The apparatusaccording to claim 1, wherein the controller determines controlinformation for controlling the mold conveyance mechanism based on thethickness information of the mold, and the controller stores, each timethe control information is determined, the control information as thelatest control information in a non-volatile memory, and controls themold conveyance mechanism based on the latest control information storedin the non-volatile memory when the mold is to be handed over from themold driving mechanism to the mold conveyance mechanism.
 18. An articlemanufacturing method comprising: forming a pattern on a substrate byusing an imprint apparatus defined in claim 1; processing the substrateon which the pattern has been formed in the forming; and manufacturingan article from the processed substrate.
 19. A pattern forming apparatusthat forms a pattern on a substrate by using an original, wherein theoriginal has a first surface and a second surface on sides opposite toeach other, the first surface including a pattern region which includesa pattern to be transferred onto the substrate and a peripheral regionwhich surrounds the pattern region, the second surface including a heldregion, and the pattern forming apparatus comprises an original drivingmechanism configured to hold the held region of the original and drivethe original, an original conveyance mechanism configured to hold theperipheral region of the original and convey the original, and acontroller configured to control, when handover of the original is to beperformed between the original driving mechanism and the originalconveyance mechanism, the original conveyance mechanism based onthickness information which indicates a distance between the peripheralregion and the held region.